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STRATEGIES: 1. Integrated, beefed-up chips. Chips are built directly into the television, but those chips come with enough performance to accommodate future innovation.
2. The modular approach. Chips are built into a module that the consumer could swap out and replace with something newer.
3. Separate boxes. TVs become thin, dumb panels that are connected by wire or wirelessly to a bundled box that has the chip inside it. As more processing power is required, the box is swapped out for a new one, but the panel remains.
links for 2009-06-04
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This page contains a single entry by Joe published on June 4, 2009 4:05 PM.
links for 2009-06-03 was the previous entry in this blog.
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